The HB75 is a Bench Top Size Die Bonder, ideal for Laboratories, pilot and small scale production lines. Easy operation with TFT Touch Screen and direct access and simple adjustment of all parameters.
+ Die Placement with Precise Movements
+ Epoxy Stamping
+ Optional Epoxy Dispensing
+ Rotation Head for Quick Tool Change
+ True Vertical Movement
+ Integrated Vacuum Pump
+ Rotatable Table
+ 6.5" TFT Touch Screen
+ Bond Arm Length 165mm
+ 100 Program Storage Capacities
+ Semiautomatic and Manual Mode
+ Tool Rotation Option
Technical Specifications
Metode Epoxy Stamping - Die Placement
Die Size min.100x100 μm max.10x10 mm
Bond Time 1 - 10.000 ms ( 1 - 20.000 sec optional )
Bond Force 10 - 150 cN ( 350 cN optional )
Tool 1,58? 19 mm
Motorized Z-Way 17 mm ( 0.67")
Bond Arm lenght 165 mm (6.7")
X-Y Manipulator 10 mm (0.4")
Parallelogra 6:1
Temperature Control up to 250°C +/-1°C
Power Supply 100 - 240V +/-10% 50/60 Hz 10A max.
Dimensions 680 (27") x 640 (25") x 490mm (19")
Weight Net 42kg
Industry Standard CE Standard
