Transmission & 3D SFT
The X2 is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component inspection. It features fully automated inspection based on a CAD compiled inspection list and uses an inspection model library for the test-strategy definition. The motion system as well as the image acquisition chain meets all demands of high-speed inspection.
X-ray System Features
? High Speed Inline AXI system
? Maintenance free sealed X-ray tube and digital detector technology
? 3 axes programmable motion system with linear drive sample table for high speed inspection mode
? Automatic grey-level and geometrical calibration
? Barcode scanner (1D/2D) for serial number and product type selection
? In-line board handling with automatic width adjust
APPLICATIONS
ELECTRONIC COMPONENTS AND SOLDER-JOINTS
A unique advanced algorithm library is available for
electronic applications, specifically for component and
solder-joint inspection on PCB, hybrid or chip level
assembly processes.
? All standard SMD’s and THT/PTH components
? Specific BGA and QFN algorithms
? Cooling plates/heatsink void inspection
SPECIFICATIONS
Physical dimension
Dimensions： 60.5” (H) x 71” (W) x 62” (D) & 1550 mm (H) x 1800 mm (W) x 1600 mm (D)，with feet adjusted so conveyor height is 950 mm (SMEMA)
Weight： 7700 lbs. (3500 kg)
Safe Operating Temperature： 60° to 90° F (15° to 32° C)
Power Consumption： max 6 kW
Line Voltage： 400 VAC, 50/60 Hz 3 phase, 16A，208 VAC, 50/60 Hz 3 phase, 25 A
Air： 5-7 bar, < 2 l/min, filtered (30μ), dry
Motion system
High-speed X-Y sample table with linear drives
Driving distance： 510 x 405 mm
Position repeatability： +/- 5 μm
Z drive： x-ray tube
Z movement with continuous magnification (FoV) change
X-ray source
Energy： 130 kV / 16 W
Power： variable wattage control
Focalspot size： 5 μm
X-ray tube orientation： End window tube
Image detector
Detector type： 3“ / 2“ image intensifier
Camera： 1028 x 1028 pixel, 10 bit
Video output： Camera link interface
Video display： High resolution 19“ TFT
Image performance
Inspection area
Max. board handling size： 18” (X) x 14” (Y) & 460 mm (X) x 360 mm (Y)
Max. inspection area ： 18” (X) x 14” (Y) & 460 mm (X) x 360 mm (Y)
FOV & resolution
Field of view： 0.4“ (10 mm) to 1.0“ (25 mm)
Spatial resolution： 20 LP / mm at min. FOV (7.5% MTF)
Assembly clearance
Top side (incl. board thickness) ： 30 mm
Bottom side (excl. board thickness)： 30 mm
Full safe, interlocked enclosure. Complies with all E.U., U.S.
and International standards for cabinet radiography systems.
CDRH directives / CE compliant.
